RELIFE HW21 183℃ solder paste (containing lead and silver)

RELIFE HW21 183°C Solder Paste is a premium-quality leaded silver solder paste specially designed for precision electronics repair and PCB rework applications. Formulated with lead and silver content, it delivers excellent electrical conductivity, superior solder joint strength, and outstanding wetting performance. Its optimized 183°C melting point allows efficient medium-temperature soldering while reducing thermal stress on sensitive electronic components. The fine and smooth paste consistency ensures easy application, minimal bridging, and reliable solder connections. With strong oxidation resistance and a no-clean formula, RELIFE HW21 produces bright, clean, and durable solder joints with very low residue, making it ideal for SMT, BGA, IC chips, LED modules, mobile phone repair, and motherboard maintenance. Whether used in professional repair shops or advanced electronics workshops, RELIFE HW21 provides stable performance, high soldering yield, and long-lasting reliability. Key Features: 183°C medium-temperature melting point Contains lead and silver for enhanced conductivity Excellent wettability and solder flow Strong, bright, and reliable solder joints Low residue, no-clean formulation Anti-oxidation and anti-corrosion properties Suitable for SMT, BGA, PCB, IC, and motherboard repair Fine paste texture for precise soldering applications